Canteliver Probe Card
MPI Cantilever Probe Card is greatly utilized on gold bump and pad wafer tests for Show driver, logic, and memory product. MPI’s cantilever probes are classified as the corresponding respond to for the needs of fine pitch, smaller pad sizing, higher speed, a lot less cleansing, multi-DUT, superior pin count, and ultra-reduced leakage needs. With fantastic craftsmanship, innovative architecture and confirmed methodologies depending on mechanical and electrical simulation/measurement benefits, generating MPI the highest cantilever company around the globe.
FCB Probe Card
The FCB Probe Card is considered the most experienced technological innovation of buckling beam probe card. It can be aimed to accomplish the semiconductor ship manufacture time-to-current market (TTM) and value of examination (COT) need. FCB is actually a confirmed Answer for a number of semiconductor production tests from early engineering pilot-operates to substantial volume manufacturing (HVM). FCB is prepared for system necessitating higher sign integrity probing (SI) and/or electrical power integrity probing (PI). Applications include things like reducing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, plus more. FCB ensures the globe’s greatest overall Price tag-of-ownership (COO) for various DUT apps.
EVS Probe Card
The EVS Probe Card is surely an improvement above the conventional buckling beam probe card. Vital attributes are better current carrying capability (C.C.C.) and decreased balanced Call force (BCF), along with Total MEMS-like traits. EVS can certainly fulfill the necessity of Sophisticated wafer probing. Specific alignment and exceptional planarity Handle would be the vital variables contributing to stable Call resistance. With its capacity and efficiency, EVS Probe Card is a great choice click here for Innovative probe cards.
Osprey probe card
The Osprey probe card is MPI’s Option to desire for ever finer pitch. It really is made for smaller Al pad, and it is ideal for tiny pitch software with peripheral and full array pattern. With specific alignment and much better planarity Handle, Osprey can attain higher efficiency by multi-DUT structure. The forming wire (FW) style needle manufactured with MPI’s have micro fabrication procedure not merely delivers superior-good quality performance and also enables uncomplicated needle replacement and shortens keeping cycle time.
Kestrel Probe Card
The Kestrel Probe Card is supplied with MEMS wire (MW) needle which is designed for the demand of low force probing. In addition, it comes with the ability to fulfill substantial C.C.C. and significant pin counts application. The MEMS process guarantees extremely steady needle attributes, and also the Exclusive construction design and style permits specific alignment and planarity Command.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
https://www.mpi-corporation.com/probecard/
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